Product name: SICOM3024P

Document No.:DT-PCN-2018002

Date of Notification: Apr 1, 2018

Affecting Customers: All

Requirements and Objectives of Changes: Following the IEC61850, improve ESD performance

Description of Change Details: 

Before change: 1) Memory chipset is Micron MT48LC8M16A2P-6A which provide 32MB storage. 2) Current panel design, gap existed on the front panel. 
After change: 1) Memory chipset is Micron MT48LC16M16A2P-6A which provide 64MB storage, this update will be more suitable for the IEC61850 MMS function model. 2) New panel design, remove the gap which will improve the ESD performance. 

Result and Impact of the Change:  1) Change impact: increase the memory storage and ESD performance. 2) Change influence: Panel appereance change. 

Affected Products: All switches

Effective Date: Apr 1, 2018